Document Type : Original Article
Authors
1
Assistant Professor, Department of Mechanical Power Engineering, Faculty of Engineering at El-Mattaria, Helwan University, Masaken El-Helmia P.O., Cairo 11718, Egypt.
2
Post Graduate student, Department of Mechanical Power Engineering, Faculty of Engineering at El-Mattaria, Helwan University, Masaken El-Helmia P.O., Cairo 11718, Egypt.
3
Professor, Department of Mechanical Power Engineering, Faculty of Engineering at El- Mattaria, Helwan University, Masaken El-Helmia P.O., Cairo 11718, Egypt.
Abstract
ABSTRACT
The generated heat in electronic components whenever electric current flows
through them causes their temperatures to rise. In order to minimize the temperature
rise of the components, the dissipation of heat is necessary for their proper
functioning. Copper based microchannel heat sinks have various advantages such
as combine high material compatibility, high surface area per unit volume ratio and
large potential heat transfer performance with highly sophisticated and economic
fabrication process. Thus, the present work aimed at evaluating the heat transfer
characteristics of water flowing through single and double stack rectangular
microchannels of different aspect ratios in electronic cooling applications under
different channel height, channel width and bottom wall thickness by uniform heat
flux q = 100 W/cm2 and Re= 800. A three-dimensional computational fluid dynamics
(CFD) model is built using the commercial package, ANSYS 14.0, to investigate the
heat transfer characteristics of water flowing in single and double stack rectangular
microchannels heat sink. Results are validated against experimental data obtained
by Qu and Mudawar [1] at uniform heat flux, q = 100 W/cm2 and Re= 1454. Nearly
uniform temperature profile and low temperature gradient are achieved in counter
flow.
Keywords
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